Capabilities — Engineering services
Semiconductor equipment engineering
Mechanical, electrical, mechatronics, embedded and manufacturing engineering for wafer foundry and back-end equipment — from a product idea to mass manufacturing support.
The six disciplines
Engineering services, organised.
Semiconductor equipment work almost never sits in one discipline. Most programmes start in one of these six and pull in two or three more as the design meets the factory.
01 / Embed
Embedded Systems
Turn a product concept into hardware and the firmware that runs it — schematics, layout, bring-up, certification and the years of sustenance after.
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02 / Connect
Factory Automation
Equipment software, SECS/GEM and GEM300 integration, EAP and MES connectivity, manufacturing data — and the intelligence layer built on top of them.
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03 / Design
Silicon Engineering
Full-chip design across ASICs, SoCs, FPGAs and chiplets — architecture, RTL, verification, DFT, analog and physical design through tape-out and post-silicon validation.
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04 / Design
Mechanical Engineering
Product design and development, engineering analysis and simulation, model-based systems engineering, and the change management that keeps a design alive for a decade.
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05 / Route
Electrical Engineering
Wiring harness design, 3D routing, schematics, bundling and segregation, power distribution and the build support that gets a harness onto the shop floor.
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06 / Build
Manufacturing
PCB, turnkey, box build, harness and cleanroom assembly under the same engineering ownership as the design — with the test capability to prove what shipped.
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01 — Engineering services
Semiconductor equipment engineering
Design, development and technical support for wafer foundry and back-end manufacturing equipment — deposition, lithography, inspection, metrology and wafer probing.
Capital equipment scope
Deposition
Lithography
Inspection
Metrology
Wafer probing
Engineering toolchain
Degas chamber engineering & precision vacuum systems
A high-reliability degas chamber prototype integrating vacuum, gas handling, thermal control and wafer handling — precise vacuum integrity, minimised wafer walk, and retrofit lift pins in Celazole U-60 with point-contact design to cut particle generation during high-temperature bake-out.
High-throughput wafer probing & mechatronic integration
A multi-site wafer probing platform at 5-micron alignment using a precision stage and vision-guided realignment, integrating AMHS, probe station, wafer chuck, ATE and DAS for high-throughput GPU and memory testing.
Advanced gear systems for vacuum applications
A differential planetary gear system for unlubricated vacuum environments — dual-speed bidirectional precision with DOE-driven material and coating optimisation, ferrofluidic sealing and line-contact gear design.
Full-lifecycle engineering
Design, prototyping, testing and production support across mechanical, electrical, embedded and software subsystems — optimised for cleanroom, high-voltage, high-accuracy and contamination-sensitive environments using simulation, DOE, FEA, SI/PI, thermal and EMI/EMC methods.
02 — Disciplines
Electronics, mechanical & system capability
Electronics & PCB
- —PCB design & development
- —Electrical 3D design
- —Power & analog electronics
- —High voltage systems
- —MEMS design & development
Mechanical & systems
- —3D mechanical design & modelling
- —Electrical system integration & testing
- —FPGA & embedded systems
- —Algorithm development
- —CE certification
Prototype development & testing
- —Preliminary design & risk assessment
- —Technology scouting & DFM review
- —BOM review & cost optimisation
- —System-level integration & environmental testing
- —Regulatory compliance & manufacturing validation
Design review gates owned by Zealogics — system requirement review through to product release
03 — From vision to execution
Our product development process
One accountable path from product idea to mass manufacturing support.
Product idea
System architecture
Schematics
PCB design
Mechanical design
Firmware design & development
Bring-up & electrical validation
Hardware / firmware integration
System test
Agency certification
Mass manufacturing support
04 — Manufacturing · HV / LV
Transforming concepts into hardware
Build services under the same engineering ownership — from bare board to cleanroom-assembled system.
PCB assembly
Electronics manufacturing to CE, UL and IPC standards.
Turnkey assembly
Design, sourcing, assembly and testing under one owner.
Box build assembly
Simple enclosures through to complex multi-rack assemblies.
Wire & cable harness
High-precision harness manufacturing to your exact specification.
Cleanroom assembly
High-precision builds in controlled ISO-4 and ISO-5 environments.
Conformal coating
Protection for electronics performance in demanding environments.
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